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CPU
| Block | Specification | Remarks | |-------|---------------|----------| | | 8 × ARM Cortex‑A78AE, out‑of‑order, 2.4 GHz (max) | High‑performance cores with ECC and lock‑step mode for safety‑critical use. | | NPU | Custom 16‑core INT8/FP16 accelerator | 12 TOPS (INT8), 4 TOPS (FP16). Supports dynamic voltage & frequency scaling (DVFS). | | GPU | Mali‑G78 MP24 | 2.1 TFLOPS FP16, optional for computer‑vision pipelines. | | Memory | 8 GB LPDDR5X @ 6400 MT/s (dual‑channel) | 51.2 GB/s bandwidth; ECC enabled. | | Storage | eMMC 5.1 (128 GB) + optional NVMe‑M.2 (PCIe Gen 4 × 4) | Fast boot and local model caching. | | Thermal Subsystem | Copper‑core heat spreader (70 mm²) + optional mini‑blower (80 mm³) | Integrated thermal sensor network (4× on‑die, 2× board‑level). | | Power Management | PMIC 12 V → 3.3 V/1.8 V with 30 W peak capability | Supports dual‑rail redundancy for safety‑critical systems. | | I/O | HDMI‑2.1 (4 K @ 60 fps), 2× 10 GbE, PCIe Gen 4 × 4, 2× MIPI‑CSI‑2 (4‑lane), USB‑4, CAN‑FD, UART, SPI, I²C | Designed for high‑bandwidth sensor fusion. | | Form‑factor | 55 × 55 mm, 13 mm height, 30 g (no heat‑sink) | Compatible with existing 871MP4 carrier boards. | fsdss871mp4 hot
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